A Premier Gathering for China's RF & Microwave Industry
The 4th National RF & Microwave Technology and Industry Development Conference convened on June 25, 2026 in Chengdu, Sichuan Province β China's western electronics manufacturing hub. Organized jointly by the University of Electronic Science and Technology of China (UESTC) and the Sichuan Electronics Society, the conference brought together over 500 experts from research institutes, universities, leading industry enterprises, financial institutions, and industrial parks.
With the theme "Key Core Technology Breakthroughs," the conference focused on frontier innovation in RF and microwave technology, 6G and terahertz development, low-altitude economy applications, and industrial chain collaboration β positioning itself as China's most authoritative platform for RF microwave industry dialogue.
Prof. Li Gun from UESTC, in his opening address, emphasized that this year's conference aims to establish a high-level national exchange and cooperation platform, promote deep integration of industry, academia, research, and application, and support China's RF microwave industry in strengthening, expanding, and extending its industrial chains.
Sichuan-Shaanxi RF & Microwave Industry Collaboration Officially Launched
One of the most significant announcements at the conference was the formal launch of Sichuan-Shaanxi RF & Microwave Industry Collaboration β a strategic partnership uniting China's two most important western electronics manufacturing regions.
π€ Regional Industry Integration: A New Paradigm
Sichuan Province β home to Chengdu's electronics manufacturing cluster, UESTC, and major defense electronics companies
Shaanxi Province β Xi'an's aerospace heartland, home to Xi'an Electronics Technology University, and China's satellite/TT&C hub
Joint Focus Areas:
- Industrial supply and demand integration
- Joint key technology research breakthroughs
- Low-altitude economy infrastructure systems
- Science and technology achievement transformation
This collaboration directly addresses the needs of BRIDZA's core markets β satellite ground terminals, timing & synchronization, and RF modules.
Industry leaders from the Sichuan Electronics Society and China Electronics Technology Group Corporation (CETC) 29th Research Institute emphasized that under China's "15th Five-Year Plan" framework, both provinces will leverage their existing industrial foundations and cluster advantages to accelerate breakthroughs in core technologies, enhance independent controllability of industrial and supply chains, and provide strong support for high-quality development of China's electronics information industry.
2026 China RF & Microwave Industry White Paper Released
During the conference, Prof. Zhai Huìqīng from Xi'an Electronics Technology University officially released the "2026 China RF & Microwave Industry White Paper" on behalf of the organizing committee.
π White Paper Coverage
Industry Status: Systematic analysis of China's current RF microwave industry development landscape, market size (estimated Β₯50 billion), and competitive positioning
Technology Barriers: Identification of critical bottlenecks in core components, high-frequency materials, and advanced manufacturing processes
Future Trends: Strategic projections for 6G integration, terahertz commercialization, and satellite-terrestrial convergence applications
The white paper serves as a critical reference for government decision-making, enterprise strategic planning, and research institute prioritization. It provides data-driven insights for stakeholders navigating China's rapidly evolving RF microwave landscape.
Frontier Technologies Driving Industry Innovation
The conference featured expert keynote presentations covering breakthrough research across multiple RF and microwave domains:
Metamaterials & Digital Electromagnetics
Academician Cui Tiejun (Chinese Academy of Sciences) presented groundbreaking research on integrated electromagnetic regulation and digital modulation β enabling programmable RF environments with applications in smart antennas and electronic warfare.
Phased Array Technology
Advanced phased array systems for satellite communications, 5G/6G base stations, and radar applications. Focus on wafer-scale integration and cost reduction for commercial deployment.
Wideband RF Integration
Next-generation wideband RF front-ends supporting multi-band operation with improved linearity and efficiency for multi-standard communication systems.
AI-Enabled RF Design
Artificial intelligence integration in RF circuit design, optimization, and automated testing β reducing development cycles and enabling predictive maintenance for complex RF systems.
Terahertz Chips
Progress in terahertz (THz) semiconductor devices for 6G candidate bands (100 GHz - 10 THz), including high-electron mobility transistors (HEMT) and resonant tunneling diodes (RTD).
6G High-Frequency Packaging
Advanced packaging solutions for 6G millimeter-wave and sub-THz components, including fan-out wafer-level packaging (FOWLP) and embedded wafer-level packaging (eWLP).
30+ Companies Showcase Latest Innovations
The conference featured an enterprise technology achievement exhibition where 30+ companies displayed cutting-edge products across six major categories:
| Category | Products Shown | Market Relevance |
|---|---|---|
| RF Chips | Wideband transceivers, low-noise amplifiers, power amplifiers for 5G/6G/satellite applications | β β β β β |
| Microwave Components | Filters, duplexers, mixers, oscillators for Ka/Ku-band satcom | β β β β β |
| High-Frequency Packaging | AiP (Antenna-in-Package), FOWLP, 3D heterogeneous integration | β β β β |
| Test & Measurement | Vector network analyzers, spectrum analyzers, signal generators, OTA testing systems | β β β |
| Systems Integration | Active phased array antennas, multi-beam terminals, LEO satcom user terminals | β β β β β |
| Supporting Infrastructure | RF shielding materials, thermal management solutions, precision mechanical components | β β |
The exhibition facilitated deep integration of innovation chain, industrial chain, and capital chain, connecting component suppliers with system integrators and investment institutions.
Expert Roundtable: Path to High-Quality Development
The conference hosted an exclusive closed-door seminar chaired by Prof. Tang Wanbin from UESTC. The session featured Academician Wu Ke β Fellow of the Royal Society of Canada, Fellow of the German National Academy of Science and Engineering, and a world-renowned microwave technology authority.
π― Key Consensus from Experts
1. Cross-Regional Shared Platforms β Establishing shared R&D and testing facilities across Sichuan, Shaanxi, and other western provinces to reduce duplication and accelerate commercialization
2. Deepened Industry Chain Collaboration β Strengthening vertical integration from materials and components to systems and applications
3. Testing & Certification System Improvement β Building comprehensive validation infrastructure for emerging RF technologies (6G, terahertz, satellite terminals)
4. Civil-Military Integration β Accelerating transfer of military-grade RF technologies to commercial applications, particularly in satellite communications and autonomous systems
These priorities directly align with market opportunities for precision timing, RF modules, and satellite ground terminals.